Introducing HUGA's chip manufacturing process-HUGA's LED chip manufacturing process can be broadly separated into two halves.  The first half involves major steps such as deposition, masking, etching, and alloying; the second half comprises of major steps such as probing, grinding, laser-cutting, and sorting before final inspection.  HUGA's chip-making process is briefly described as below:

Deposition-The wafer passing the QC control in epitaxy growth process is then placed and coated evenly in the deposition chamber where the conductive material coated on the wafer is vaporized after the electronics gun shooting.

Masking-After the deposition process, the topology for a given LED semiconductor chip is imprinted on the wafer through photo mask.

Etching-The wafer that has gone through the photo-masking process is then treated with chemical solution to wipe off the un-wanted portion.

Alloying-Before pushing into the second half of HUGA's chip-making process, the wafer after etching is placed in the oven for thermal treatment to enhance the bondibility between deposited layers.

Probing-The wafer that has gone through several runs of the repetitive procedures in the 1st half of the chip-manufacturing process is mounted on the probing machine to record its optoelectronic attributes as a file to be used later in the sorting machine.

Grinding-The wafer after initial probing is then grounded and polished.

Laser-Cutting-The ground wafer is fed into the laser cutter for slicing. 

Sorting-The sliced wafer is mounted on the sorting machines for re-classification, based upon product's optoelectronic attributes.  Chips with similar optoelectronic attributes are re-grouped onto the same page.

Inspection-HUGA's chip is ready for shipment only after final inspection and electronic attributes verification are both conducted at the very last step.